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first_img Visa partner Reap plans to launch a Mexican Peso stablecoin, exploring 24/7 on-chain foreign exchange

According to CoinDesk, Daren Guo, founder of Reap, a Hong Kong fintech platform and Visa partner, stated that Reap plans to add a Mexican peso stablecoin to its card, cross-border payment, and fund management products, and is exploring stablecoins for the Hong Kong dollar, euro, Korean won, and Japanese yen to support around-the-clock on-chain foreign exchange settlements and reduce cross-border costs.Reap is a major issuing member of Visa in Hong Kong and Mexico (VPIM), owned by Kraken's parent company Payward, and can issue cards on its own BIN, claiming to support partners in over 100 markets. Guo noted that while public blockchains continue to operate, global foreign exchange still relies on bank operating hours, correspondent banks, and settlements that can take several days. Transfer fees for some currency corridors in emerging and cross-border markets can reach 5% to 7%, while nearly 99% of current stablecoin payments are denominated in US dollars.The company is integrating stablecoin settlements into a broader product system that includes cards, cross-border payments, fund management, and compliance risk control. Reap stated that in the first half of 2026, card and payment volumes grew by 33% year-on-year, with revenue and transaction volume expected to double in 2025. Stephen Karpin, President of Visa Asia Pacific, stated that blockchain settlement should not be viewed as a replacement for traditional payment systems, but rather as a complementary relationship, with opportunities to reduce friction and maintain interoperability with the broader financial system.

first_img Samsung Electronics plans to expand production of 4-nanometer to meet HBM4 demand

According to Money Today on September 21, Samsung Electronics is advancing the expansion of advanced process capacity in wafer foundry due to the growth of the HBM market. To meet the rising demand for HBM4 base chips, it is evaluating the expansion of its 4-nanometer process. Samsung's HBM4 consists of 10-nanometer 6th generation (1c) DRAM core chips and 4-nanometer logic base chips, with the base chips responsible for high-speed data exchange with AI accelerators such as GPUs.Unlike SK Hynix, which uses TSMC's 12-nanometer process for HBM4 base chips, Samsung employs its own 4-nanometer process. This production line is operating at full capacity and has taken on orders from companies like Nvidia and Groq for 3 LPU, and the company has recently raised its prices for new 4-nanometer orders and HBM4 base chips. Samsung expects HBM4 revenue in the third quarter to increase more than threefold quarter-on-quarter, with HBM4 accounting for significantly more than 60% of HBM revenue in the second half of the year. The additional expansion at P4 in Pyeongtaek will mostly be used for 1c DRAM for HBM, with more than half of the wafer foundry's 4-nanometer capacity allocated to HBM4 base chips.HBM4E also uses 4-nanometer base chips, and Samsung provided samples to customers in May. The company is also evaluating the construction of a new 2-nanometer production line for HBM5, aiming for a GAA structure 2-nanometer process and increasing TSV density to improve operating speed by more than 50% compared to HBM4E. Samsung started the first generation of 2-nanometer mass production in the second half of last year and is advancing the second generation of products in the second half of this year. Citigroup expects global HBM bit demand to reach 75.2 billion Gb next year, a year-on-year increase of 62%, with supply around 59.4 billion Gb and a gap of about 21%.
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