BTC $79,790.86 -0.15%
ETH $2,507.81 +0.16%
BNB $748.93 -2.02%
XRP $1.41 -0.70%
SOL $105.40 +0.84%
TRX $0.3352 +0.63%
DOGE $0.0898 -1.08%
ADA $0.2208 -0.15%
BCH $257.12 -1.95%
LINK $13.07 +6.77%
HYPE $86.35 +0.65%
AAVE $133.91 -1.29%
SUI $0.8028 +0.77%
XLM $0.1874 +0.50%
ZEC $1,192.09 +11.89%
BTC $79,790.86 -0.15%
ETH $2,507.81 +0.16%
BNB $748.93 -2.02%
XRP $1.41 -0.70%
SOL $105.40 +0.84%
TRX $0.3352 +0.63%
DOGE $0.0898 -1.08%
ADA $0.2208 -0.15%
BCH $257.12 -1.95%
LINK $13.07 +6.77%
HYPE $86.35 +0.65%
AAVE $133.91 -1.29%
SUI $0.8028 +0.77%
XLM $0.1874 +0.50%
ZEC $1,192.09 +11.89%

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Flash

Data: Over the weekend, the capital flow of mainstream public chains showed divergence, with BNB Chain experiencing net inflow and Robinhood Chain currently facing capital outflow

According to on-chain data from DeFiLlama, there was a significant divergence in the capital flow of mainstream public chains over the weekend. BNB Chain saw a net inflow of approximately 28.22 million USD in the last 24 hours, indicating that funds are still continuously gathering in the BSC ecosystem; in contrast, Robinhood Chain experienced a net outflow of about 18.04 million USD in the last 24 hours. Earlier data from September 5 showed that Robinhood Chain had a net outflow of approximately 21.07 million USD in a single day, making it the network with the largest capital outflow among major public chains that day.In terms of capital activity, although Robinhood Chain experienced a net outflow, on-chain trading activity remained relatively high. DeFiLlama data shows that its DEX trading volume in the past 7 days was approximately 10.424 billion USD, an increase of 95.26% compared to the previous week, with a DEX trading volume of about 1.368 billion USD in the last 24 hours; BNB Chain's DEX trading volume in the past 7 days was approximately 8.254 billion USD, a weekly increase of 20.99%, with a net inflow of about 28.22 million USD in the last 24 hours.Meanwhile, data from September 6 indicated that Solana's DEX trading volume in the past 24 hours was approximately 1.96 billion USD, surpassing BNB Chain's 1.64 billion USD and Robinhood Chain's 1.61 billion USD, reclaiming the top spot in DEX trading volume among mainstream public chains. Overall, the past weekend showed characteristics of "high trading activity maintained, with a rebalancing of capital flow" among mainstream public chains: BNB Chain continued to absorb funds against a backdrop of high trading volume, while Robinhood Chain, despite rapid growth in DEX trading volume, experienced continuous net outflows, suggesting that some funds may be leaving the network after high-frequency trading.

Galaxy Research: Coldcard attackers continue to transfer funds, approximately 45% of the stolen assets have entered mixing or cross-chain pathways

Galaxy Research published that the attackers in the Coldcard "Wave 3" attack are still continuously transferring the stolen funds. During this phase, the attackers created 293 2-of-2 multi-signature wallets for each victim's assets. The first batch of funds was transferred across chains to Ethereum via THORChain; the latest round of transfers has begun entering the CoinJoin mixing process.Currently, the Wave 3 attackers are processing the largest amounts of stolen funds in order of the stolen amount, having sequentially transferred the funds from wallets ranked 1 to 11. The next 10 wallets that have not yet been transferred hold a total of 30.81 BTC, while wallets ranked 61 to 293 hold a total of 33.77 BTC. So far, the attackers have transferred about 45% of the stolen assets from this exploit, with funds flowing to Ethereum (via THORChain) or entering CoinJoin mixing transactions. Additionally, this fund transfer has revealed a previously unknown wallet: 58 addresses jointly spent in a 2-of-2 multi-signature format identical to that of Wave 3, and these were further transferred by the Wave 3 attackers to a jump address that funds CoinJoin.The on-chain analysis team currently marks this wallet as "cause = open," but believes it likely also belongs to Coldcard victims, which means the number of wallets involved in Wave 3 may increase to 294, raising the previously reported total amount stolen from the Coldcard vulnerability to approximately 1806 BTC. Currently, about 82% of the stolen BTC remains in addresses initially controlled by the attackers, while about 18% has been transferred, with the flow of funds indicating that it may be undergoing laundering processes.

first_img Analysis: China's storage is divided among CXMT, YMTC, and XMC

Researcher Schulz_Research stated that China's storage advancement is no longer a story of a single company, but rather a division of labor among three companies: CXMT is responsible for DRAM wafers, YMTC is responsible for NAND and has added DRAM in its latest factory, and the foundry controlled by YMTC, XMC, is responsible for stacking products from both. This division corresponds to the rules set by Beijing since late December last year, which state that new factory approvals must show that at least half of the equipment is domestically sourced, with exemptions only granted when there are no domestic options available. YMTC's Wuhan Phase III is the first advanced storage project to pass this rule and is set to begin production later this year.CXMT operates three 300mm DRAM factories, each producing about 100,000 wafers per month; models indicate it will reach 350,000 wafers by the end of 2026, and if all announced projects are completed, the total will exceed 600,000 wafers. YMTC's first two factories in Wuhan have a combined capacity of 200,000 wafers, with Phase III expected to reach 50,000 wafers by 2027 and full production of 100,000 wafers, along with plans to build two more factories of similar scale. XMC has two 12-inch factories, each with about 30,000 wafers, and an HBM packaging line producing about 3,000 wafers per month. China supplies about 10% of the global DRAM bits, with YMTC accounting for 14% of NAND bit shipments in the second quarter, and China consumes about 30% of global storage.CXMT has begun mass production of DDR5 and LPDDR5 and plans to start mass production of HBM3 this year, having already sent samples to domestic AI hardware developers. XMC has spent two years building HBM packaging based on hybrid bonding and YMTC's stacking IP, and is still advancing TSV technology.

first_img TSMC and others' expansion has driven the top five semiconductor foundries' engineering orders to exceed 880 billion yuan

Taiwan Semiconductor Manufacturing Company, Micron, and other companies are increasing capital expenditures to expand production, driving the combined orders of the top five semiconductor engineering firms—HanTang, Axiom, FanXuan, Yankee, and ShengHui—to exceed 880 billion yuan, a record high. Taiwan Semiconductor Manufacturing Company recently stated at a semiconductor exhibition that it is building up to 20 wafer fabs, with the overall capacity expansion scale increasing multiple times compared to the past, but it still cannot meet customer demand. The U.S. tariff policy has driven the demand for manufacturing plants in the United States. Axiom has the largest order amount of 440.73 billion yuan, and Chairman Yao ZuXiang pointed out that the cumulative amount of turnkey projects undertaken in Singapore over the past four years has reached 600 billion yuan, with expectations for new projects to follow. HanTang's order amount is approximately 193.937 billion yuan, setting a new record, benefiting from continued plant construction by major clients like Taiwan Semiconductor Manufacturing Company and Micron.FanXuan's order amount reached a new high of 135.1 billion yuan, and Chairman Gao XinMing revealed that order visibility extends at least to 2028, with related projects for clients planned for 2029 and 2030. FanXuan has deployed materials, manpower, and local construction teams to support clients in Taiwan, Arizona in the United States, Japan, and Germany in synchronizing production expansion needs, and is investing in the development of technologies such as CoPoS. ShengHui's order amount exceeds 60 billion yuan, with Taiwan accounting for 68% and semiconductor orders accounting for 63%. In the first half of the year, the after-tax net profit was 2.944 billion yuan, with earnings per share of 23.73 yuan, setting a new high for the same period. Yankee's after-tax net profit in the first half of the year was 2.317 billion yuan, with earnings per share of 17.46 yuan, and the order amount is approximately 51.77 billion yuan, with order visibility reaching the end of 2027.

first_img Amazon expands AI cabinet delivery, World Semiconductor, Wistron, and Hon Hai show strong shipments

The supply chain reports that Amazon, a leading North American cloud service provider under AWS, has recently expanded the delivery of AI server cabinets, with strong shipping momentum from partners such as TSMC, World Advanced, Wistron, and Hon Hai. Amazon has recently revised its capital expenditure for this year, increasing the original estimate from $200 billion to $220 billion, primarily for AI infrastructure, including data centers, servers, and network equipment.Amazon CEO Andy Jassy is optimistic that the demand for AI computing power will continue to exceed supply until 2027, and he has even seen strong demand for 2028. AWS's AI business and self-developed chip scale have grown to $25 billion, maintaining triple-digit percentage growth. Annapurna Labs' customized ASIC chips are mostly produced by TSMC using advanced 3-nanometer processes.World Advanced is an important partner for AWS's self-developed AI chips and is optimistic that its quarterly revenue and profits will reach new highs this season, with continued growth expected in the fourth quarter. The demand for 3-nanometer AI accelerators is better than previously assessed, and designs can be finalized before the end of the year. AWS's ASIC AI cabinets are assembled by Wistron, which also supplies switch trays, while Hon Hai is involved in CPU trays. Hon Hai's rotating CEO, Liu Young-way, stated that this year's ASIC project has made new progress, setting a target for ASIC server market share at over 40%.

first_img Goldman Sachs: Optical networks are the next trend in AI infrastructure, with TAM increasing 9 times to 154 billion USD

Goldman Sachs' Global Technology Equity Research Team released a report on April 17, 2026, stating that networks unlock the computing power of a single AI chip by connecting multiple chips, enabling seamless data exchange and low latency. With the expansion of AI infrastructure and the enhancement of computing power, various configurations are expected to see growth, further opening up a 9-fold Total Addressable Market (TAM) space to $154 billion.The report pointed out that the dollar content of horizontal and vertical scaling increases by 16 times and 45 times, respectively; the TAM for optics expands 13 times from horizontal to vertical scaling; the market value of pluggable optical modules in horizontal scaling expands 10 times from AI server models in the second half of 2025 to models in the second half of 2027. The authors include Allen Chang, Verena Jeng, James Schneider, Mark Delaney, among others.The total dollar content for each computing unit in vertical and horizontal scaling is expected to increase from $315,000 for GB300 NVL72 to $9.4 billion for Rubin Ultra NVL576, a 29-fold increase. The total value TAM increases 9 times to $154 billion (mainly in 2028), of which 69% ($106 billion) comes from vertical scaling. The analysis covers the dollar content and market opportunities of configurations such as copper cables, pluggable optical modules, CPO, and PCB backplanes.

first_img SK Hynix accelerates the expansion of its 1c DRAM market share, becoming the main force by early next year

According to the Chosun Ilbo report on September 7, SK Hynix is accelerating the increase of the production share of 10-nanometer sixth-generation (1c) DRAM. Industry data shows that its 1c DRAM share rose from about 10% in the first quarter of this year to about 13% in the second quarter, and is expected to reach about 24% in the third quarter and about 34% in the fourth quarter; it may rise to about 35% in the first quarter of next year, surpassing 1b (about 33%) for the first time and becoming the main process. The share of 1b (10-nanometer fifth-generation) DRAM peaked at about 43% in the second quarter of this year and has since begun to decline.By the end of the second quarter, Samsung Electronics had a 1c share of about 16% and Micron about 19%, both higher than SK Hynix's approximately 13%. Reports indicate that SK Hynix is accelerating the transition in the second half of the year, and in the fourth quarter, it may exceed Samsung Electronics' approximately 31% with about 34%. SK Hynix stated in its second-quarter earnings call that the supply of DRAM using the 1c process will substantially begin from the second quarter, and in the second half of the year, with the ramp-up of HBM4 and increased shipments of 1c general DRAM, the bit growth rate will be higher than in the first half.Samsung Electronics will use 1c DRAM starting with HBM4, with a running speed of about 11.7Gbps; SK Hynix previously prioritized ensuring mass production stability with verified 1b DRAM and advanced MR-MUF packaging, and will use 1c DRAM for the first time as the core chip for HBM starting with the next generation HBM4E. Counterpoint Research and others estimate that this year, the market share of HBM4 under the combined metrics of Nvidia, Google, and AMD is approximately 50% for SK Hynix in the mid-range, 20% for Samsung Electronics in the later range, and 10% for Micron in the later range.
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