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layer

Layer is an Ethereum scaling solution that utilizes Web Assembly, allowing developers to write applications in languages like Rust that can run anywhere—even on an iPhone. Layer's product "Layer SDK" enables developers to build new layers on Ethereum, which run blockchain-based full-stack applications, including smart contracts, consensus mechanisms, UI, and verifiable off-chain services (AI agents, ZK provers, serverless functions, decentralized messaging servers, etc.).
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first_img Optimum Blockchain Transmission Layer mump2p launched on the Ethereum mainnet, ether.fi requires all nodes to adopt

A network startup company called Optimum, led by Professor Muriel Médard from the Massachusetts Institute of Technology, announced that its block propagation software mump2p has officially launched on the Ethereum mainnet. The Ethereum liquid staking protocol ether.fi has made mump2p a mandatory requirement for all 12 of its node operators, whereas previously the software was optional for its operators.Optimum stated that there are currently 16 node operators running mump2p in production environments, collectively managing approximately 22,000 validator keys and over 1.4 million staked ETH, accounting for more than 3% of the total staked amount on Ethereum. Partners include Blockdaemon, Everstake, P2P.org, Stakefish, and Bitcoin Suisse. The software operates in a sidecar gateway manner, not replacing Ethereum's default GossipSub, but rather overlaying it on top of libp2p and utilizing random linear network coding technology. Optimum claims that the block arrival speed is 2.42 times faster than GossipSub, with an approximately 7.88 times reduction in arrival time variance.Rok Kopp, co-founder and Chief Growth Officer of ether.fi, stated that they will not require the entire validator set to adopt a new infrastructure unless they are confident that it can enhance the overall level of stakers and the network. Médard mentioned that traditional financial institutions invest billions of dollars to shorten execution times to the millisecond level because speed is money. Optimum launched its private testnet in June 2025, having previously completed a $11 million seed round financing led by 1kx, and plans to expand the protocol to other high-throughput blockchains after Ethereum.

first_img Lido will directly expand ETH staking to four Layer 2s

Lido announced the integration of direct ETH staking functionality for Arbitrum, Base, Linea, and Optimism Layer 2 networks into its official staking interface, which was announced on October 15. This process is supported by Chainlink's cross-chain interoperability protocol CCIP, allowing users to directly obtain wstETH on the originating network without manually transferring ETH across chains to Ethereum and back.Lido stated that users' ETH will be exchanged for wstETH through dedicated liquidity pools on the same L2, with the Chainlink price feed reflecting the exchange rate of the Lido protocol rather than the exchange market price. The underlying staking still occurs on the Ethereum mainnet: the ETH deposited by users on L2 will automatically be transferred to Ethereum and staked through Lido, after which wstETH will be sent back to replenish the local liquidity pool. Users receive the wrapped version of stETH, wstETH, which maintains a fixed balance while its value reflects staking rewards.This functionality integrates existing cross-chain infrastructure into Lido's own interface. Lido previously introduced relevant channels for Arbitrum, Base, and Optimism in October 2024, with third-party frontends including XSwap, OpenOcean, and Interport, while Linea followed up in October 2025. In terms of fees, users will still need to pay L2 transaction gas, and cross-chain costs come from the separately funded contract balance rather than staker deposits;

first_img Samsung and SK Hynix respond to HBM4E heat dissipation, AI intermediary layer may expand to 40 times

TrendForce reported on October 12, citing Chosun Biz, that as AI packaging accommodates more computing and storage chips, the intermediary layer connecting computing chips and HBM is expected to significantly increase in size, making next-generation HBM cooling more important. Samsung Electronics is preparing multiple technologies to address the cooling challenges of HBM4E, which is scheduled to begin mass production next year.Currently, the area of the AI intermediary layer is about 5.5 times the maximum exposure area of 858 square millimeters of an EUV lithography machine. Semiconductor equipment industry insiders expect that the intermediary layer carrying HBM could expand to 9 times, 12 times that area, and ultimately about 40 times. Reasons include limitations in process miniaturization and the popularity of chiplet-style 2.5D packaging, where multiple computing chiplets and HBM stacks are placed on the same intermediary layer, making it difficult for a single advanced process chip to meet AI computing power demands.Samsung is considering hybrid copper bonding and thermal path blocks. The former replaces the micro bumps between stacked DRAM chips with direct copper-to-copper connections, which can reduce inter-layer gaps, make the stack thinner, and improve heat dissipation, a technology Samsung showcased at NVIDIA GTC in March 2026. The thermal path block establishes a dedicated thermal path in the D2D PHY area responsible for high-speed transmission between HBM base chips and GPUs, which Samsung is validating with HBM4E and plans to implement in HBM5. According to ETNews, SK Hynix's iHBM places high thermal conductivity but electrically insulating cooling materials around the heat-concentrated D2D PHY, which is expected to reduce thermal resistance by about 30%.
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