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hot_img Centrifuge releases governance proposal: exploring the conversion of CFG tokens into equity

Centrifuge released governance proposal CP172 on August 18, exploring the feasibility of converting CFG tokens into company equity. The proposal states that Centrifuge's current business has shifted towards institutional infrastructure, and the original token structure restricts partner expansion and capital raising. It proposes to offer eligible CFG holders the option to convert their tokens into equity.The core details of the proposal include: 1 CFG can be exchanged for 1 share of Centrifuge Inc. equity, which will be recorded in a tokenized form; qualified holders with more than 100,000 CFG can directly enter the shareholder register, while holders below this threshold are proposed to participate through CoinList's trust structure, with no additional fees or minimum requirements; holders who do not participate in the conversion can continue to hold or sell their tokens, and the team, community, and partners will receive the same class of shares. The proposal is currently in the Request for Comments (RFC) stage for 14 days and will proceed only after board approval and governance voting.It is reported that Centrifuge is an open decentralized infrastructure for on-chain asset management and real-world asset (RWA) tokenization. The platform enables asset management companies to tokenize institutional-grade assets (such as credit, real estate, and government bonds) into freely transferable tokens for use in the DeFi ecosystem. Its core components include a compliant asset origination framework, Anemoy (a full-service fund architecture asset management division), and index proof (PoI) infrastructure for tokenizing structured financial products (such as S&P 500 index funds).

hot_img NVIDIA's Feynman platform is expected to go into mass production in 2028, with TSMC's A16 and SoIC expanding production simultaneously

According to DIGITIMES, NVIDIA's next-generation AI platform Feynman aims for mass production in the second half of 2028, utilizing TSMC's A16 process and incorporating SoIC 3D stacking and CPO technology. The Rubin generation focuses on integrating multiple small chips with HBM, while Feynman further develops towards 3D small chips, SoIC, and CPO. The report indicates that TSMC is accelerating the construction of related production capacity, with the original plan for SoIC monthly capacity to reach 20,000 pieces by the end of 2026, now updated to a target of 50,000 pieces by the end of 2027.The construction progress of TSMC's Chiayi AP7 and Tainan AP8 is also accelerating, with AP7 planned in 8 phases. P1 and P2 have entered installation, P3 and P4 have obtained construction permits, and P5 to P8 are still in planning. In addition to mass-producing Apple-specific WMCM, the factory will configure SoIC, CoPoS, and CPO production lines according to customer demand. NVIDIA has rapidly shifted its R&D and supply chain resources to the Feynman platform, and the spillover effect of TSMC's advanced packaging orders continues to expand, with Siliconware becoming the main testing and packaging factory for NVIDIA's CoWoS and CPO orders. The NVLink interconnect bandwidth of NVIDIA's Feynman platform is expected to exceed 1 PB/s, further improving from Rubin Ultra's 520 TB/s. TSMC's COUPE technology integrates EIC and PIC in 3D through SoIC to form a light engine, advancing optoelectronic conversion from traditional circuit boards to the internal packaging structure. Since 2026, NVIDIA has invested over $40 billion in building the AI ecosystem, covering areas such as models, wafer manufacturing, data centers, and optical communications.
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