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BIP-110 soft fork is nearing activation, miners and exchanges need to pay attention to chain fork risks

According to Bitcoin Magazine, the BIP-110 soft fork is about to enter a critical activation phase. The proposal will enter the mandatory signaling phase around August 9, corresponding to block height 961,632, and is expected to lock in at block 963,648 by the end of August, with new transaction rules activated at block 965,664 in early September. BIP-110 adopts a 55% signaling threshold, and its restrictions will be enforced for 52,416 blocks (approximately one year).BIP-110 mainly restricts transaction features such as large data pushes, oversized output scripts, undefined witness versions, and Taproot annexes, but exempts UTXOs created before activation, maintaining compatibility for standard currency use. Analysis indicates that most businesses do not need to take action—businesses that act as value storage or process transactions through third-party payment providers are essentially unaffected. Businesses running their own full nodes can choose whether to switch to BIP-110 nodes. The core risk to be aware of is chain forking. If a fork occurs, miners should choose the branch expected to prevail or pause and wait; exchanges and custodians should increase confirmation requirements, monitor dual chains, and delay final settlements to prevent double spending and false confirmation risks. If there is no fork, no special actions are required.

Changxin Memory is considering building a second DRAM wafer factory in Beijing and is in talks for financing support

According to Reuters, informed sources say that Changxin Storage is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang and is negotiating financing with the Beijing Economic and Technological Development Zone and several state-owned technology companies. The company is seeking at least 60 million yuan (approximately 8.9 million USD) in support, but negotiations are still in the early stages, and the scale and structure of the financing may be adjusted.The proposed factory will be located at the site of Changxin Storage's existing DRAM wafer fab in Beijing. The planned production capacity and total investment for the project have not yet been determined, while building a fab capable of producing advanced DRAM typically requires over 10 billion USD. Currently, Changxin Storage operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly production capacity of about 100,000 wafers. Changxin Storage is also building new factories in Shanghai and Hefei, and once the related projects are fully operational, the company's monthly production capacity could double to over 600,000 wafers.This expansion comes as demand for storage chips is driven by AI infrastructure, data centers, and consumer electronics entering an upward cycle. The company completed an 8.6 billion USD IPO last month, marking the largest fundraising for a semiconductor company listed in mainland China, and its stock price has risen by 13% since going public. Changxin Storage is currently the fourth largest DRAM manufacturer in the world, but Samsung Electronics, SK Hynix, and Micron together still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing funding and other support to Changxin Storage to gain economic and strategic benefits from its expansion.
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