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Justin Sun announced the establishment of the "Justin Sun Award" and announced the first batch of winners, with the OpenAI team receiving the top prize of 1 million USD

The founder of TRON, Justin Sun, announced the official establishment of the "Justin Sun Award" and revealed the first batch of winners. This is the world's first zero-trust, decentralized academic reward mechanism based on a "problem list," with significant breakthroughs in fundamental disciplines and machine formal verification as the sole criteria for awarding, with a maximum prize of up to 1 million dollars for a single problem.Justin Sun stated that the award aims to initiate a new scientific incentive paradigm centered on machine verification, powered by human-machine collaboration, and driven by decentralized rewards, striving to create a Nobel Prize for the AI era.The top prize of 1 million dollars was awarded to the OpenAI research team in recognition of their completion of the "Existence and Smoothness of the Navier-Stokes Equations" solution and formal proof. Other awarded achievements include the Sandorff Conjecture, Erdős Disjoint Subset, and other problems, involving a total of 66 mathematical problems.It is reported that the "Justin Sun Award" is open to all contributors, with no identity restrictions; both humans and AI can win, but only the first completer of the listed problems will be awarded. The problem list and proof materials are publicly available on GitHub, and the prize is recorded on-chain. The award covers mathematical progress made from January 1, 2026, onwards; those who complete formal verification of previously solved problems afterward can also win.

Wintermute: BTC ETF sees its first net outflow since June, as the market awaits the Federal Reserve's interest rate decision

According to Wintermute OTC trader @Jjay_dm, the BTC ETF experienced a net outflow of $463 million, marking the first negative value since the low in June, with ARK and Grayscale accounting for a combined outflow of $371 million, while BlackRock remained flat. As a result, BTC fell 4.4% over the week, closing at $76,838, making it the worst-performing asset, while Ethereum dropped 1.5%, and altcoins overall rose by 1%.On a macro level, the U.S. August CPI recorded a month-on-month increase of 0.4% (core 0.3%), higher than the expected 0.2%, and the PPI annual rate reached 5.4%, prompting Goldman Sachs to change its September forecast from "hold steady" to "raise interest rates." The market's expectation for a 25bp rate hike on Wednesday has risen to 87%. Meanwhile, the situation in the Middle East continues to escalate, with Brent crude oil surpassing $105 per barrel, and the 10-year U.S. Treasury yield hitting a 20-year high.Wintermute stated that after the ETF fund outflow turned negative, it tends to hold a neutral rather than bullish stance on the market. This week has two key events: ① On Tuesday, the U.S. Senate will conduct a procedural vote on the CLARITY Act (the cryptocurrency market structure bill), which requires 60 votes to pass; ② On Wednesday, the Federal Reserve will announce its interest rate decision, with the rate hike itself already priced in, but subsequent hawkish statements (especially signals regarding continued rate hikes in the first quarter of 2027) may pose downward pressure on the cryptocurrency market.

first_img XRP Ledger upgrade Batch V1.1 is just one vote away from activation

The Batch V1.1 upgrade for the XRP Ledger is just one vote away from initiating the activation process. The RippleX team has fixed 11 software defects in the latest review. The Batch feature allows users to combine up to eight related transactions into a single operation, ensuring that both parties complete the transfer simultaneously when two people exchange tokens, thus avoiding the situation where one party pays while the other fails.In Tuesday's snapshot, the upgrade received support from 27 out of 35 trusted validators, accounting for approximately 77%, while changes to the XRP Ledger require an 80% support rate. Therefore, currently, one validator's vote can determine success or failure, and obtaining one more vote will initiate a two-week activation countdown. The support rate must remain above this threshold for 14 days, during which validators can change their votes.Previously, researchers discovered vulnerabilities in the original Batch proposal, allowing attackers to initiate transactions using others' accounts without authorization under specific conditions; this version was not deployed on the mainnet. The new version was released with xrpld 3.3.0 on August 6, and the latest review found 11 issues related to signatures, authorization checks, and server crashes. Among these, a serious vulnerability rated by the security company Common Prefix could allow attackers to reuse user signature permissions to execute transactions beyond expectations. RippleX stated that the review involved four senior engineers, audits from Halborn and Common Prefix, public security competitions, and automated testing, and mentioned that commercial projects using Batch have been signed or are in development.

first_img TSMC 3/2 nanometers and CoWoS remain tight, AWS and MediaTek's capacity allocation has changed

As we enter the late third quarter of 2026, TSMC's 3nm and 2nm advanced process and CoWoS advanced packaging capacity continue to be in high demand. NVIDIA and Apple continue to dominate the resources for advanced processes and packaging; Amazon AWS's Annapurna has recently increased its AI self-developed chip production, securing more 3nm capacity. MediaTek, in addition to mobile chips, is also competing for 2/3nm process and CoWoS-S/L capacity with large orders related to Google TPU.There are reports that TSMC has recently readjusted its capacity allocation. After MediaTek secured a large order from Google TPU, the next-generation TPU v9 will simultaneously use TSMC's CoWoS-L and Intel's EMIB-T, which has slightly adjusted MediaTek's 3nm and 2nm capacity arrangements. Currently, TSMC's main customer for 3nm is NVIDIA, which is expected to surpass Apple to become the largest customer by 2025; the demand for 2nm is primarily from Apple and others. After AWS increased Annapurna's production, its 3nm and CoWoS configuration priority has improved.Starting in early 2026, TSMC will accelerate capacity expansion, with the 2nm monthly capacity of Hsinchu Baoshan Fab 20 and Kaohsiung Fab 22 reaching 50,000 wafers each by the end of October, totaling about 100,000 wafers; by the end of October, the monthly capacity for 3nm in Tainan Science Park is about 185,000 wafers. As of the end of September, the overall capacity utilization rate is about 96.2%, with 100% utilization for processes below 16/12nm down to 2nm. The shortage of CoWoS supply has driven advanced packaging orders to overflow, with the priority for orders going to ASE Group's Siliconware Precision Industries first, followed by Amkor, and Chipbond, among others. Chipbond's related testing and packaging capacity is fully loaded, with order visibility extending to 2028.

first_img TSMC accelerates its layout in CPO, and the industry is optimistic about forming a new Moore's Law

According to Taiwan's "Commercial Times" report on September 14, as the computing power of GPUs and ASICs continues to rise, traditional copper interconnects are gradually approaching the limits of power consumption and signal transmission. TSMC is accelerating its layout for co-packaged optics (CPO). The industry is optimistic that if CPO bandwidth continues to double every two years, it may form the "CPO Moore's Law" of the AI era. Industry analysis indicates that the upgrade of CPO bandwidth mainly has three paths: including increasing single-channel speed from 200G to over 400G, expanding the number of optical channels from 16 to 32, 64 or more, and introducing wavelength division multiplexing (WDM). By 2040, the theoretical value could reach about 128 times the current level, with long-term potential for development towards hundreds of T based on the current level of about 3.2T.TSMC's role in optical interconnects has extended from wafer foundry to system integration, gradually integrating computing, HBM memory, and high-speed I/O from 3DFabric, CoWoS, SoIC to silicon photonics and CPO. When high-speed electrical signals exceed 200G, signal attenuation increases after passing through longer copper paths such as ABF substrates, PCBs, and connectors, leading the industry to develop shorter copper paths and longer optical paths. In terms of packaging architecture, the optical engine is currently laid out on the substrate, and the next step is expected to place CPO in the intermediary layer, with future possibilities of using SoIC technology to achieve 3D vertical integration of photonic integrated circuits (PIC) and ASICs. Industry players indicate that CPO still needs to overcome challenges in packaging, optical coupling, and testing before mass production can be achieved.
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