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Binance responded to the theft incident, stating that no private key leakage has been found so far

Binance customer service representative Sisi responded to community questions on social media, stating that this attack was not an event that could be completed through a single device; the starting point of the attack was a compromised employee's computer. Attacks on cryptocurrency institutions are usually highly targeted, and attackers often attempt to use complex methods to implement infiltration. Binance has discovered important clues related to the incident and has taken measures to control risks. Relevant investigations and tracing are still ongoing, and the platform's core risk control and emergency mechanisms have been activated.Regarding whether the engineer's permissions are too extensive, Sisi stated that this is not an incident where the attacker could directly use a specific engineer's permissions to complete a fund transfer, nor is it the result of a single person being able to operate with one click; the related anomalies involve a more complex attack process. At this stage, the investigation has not attributed responsibility to any individual, and the company will assume corresponding responsibilities while continuing to promote subsequent handling and security upgrades.Currently, there is no evidence of wallet private key leakage. The total losses from this incident will be fully borne by the SAFU fund and company funds, with no need for users to bear any costs. Approximately $3 billion in affected assets have been frozen on-chain, and Binance is cooperating with law enforcement and blockchain intelligence agencies to trace the funds, which are publicly traceable on-chain. Deposits are fully open and unaffected; withdrawals have been suspended as a precautionary measure and are expected to reopen within 48 hours, with specific timing subject to official announcements. Binance will continue to update progress while ensuring the accuracy of the investigation and will publish detailed information and further security reinforcement measures after the incident is handled and reviewed.

Sun Yuchen responds to the lawsuit against WLFI: Business is business, and it does not affect the positive outlook on U.S. technology and cryptocurrency policies

Recently, Sun Yuchen discussed his lawsuit against the Trump family's cryptocurrency project WLFI in a conversation with Jin Ming. He clearly stated that he remains firmly supportive of President Trump's cryptocurrency policy and AI strategy, believing it to be very successful.The reason for suing World Liberty Financial is entirely a normal action for commercial investors to protect their rights. The cause stems from the project's lack of investment transparency and insufficient information disclosure, even involving allegations of fraud. The case has been formally submitted to the federal court in California and is to be decided by a federal judge, which fully complies with the operation of the rule of law in the United States.Sun Yuchen further clarified that this lawsuit will not affect his judgment of the macro trends in the United States. He continues to hold a significant position in U.S. technology stocks and is optimistic about TRX being approved for a spot ETF in the U.S., the on-chain business of U.S. stocks, as well as expectations for a stronger dollar and the continued strength of the AI industry.Sun Yuchen believes that public opinion has exaggerated and complicated this lawsuit; in fact, it is simply a "business-to-business" lawsuit. Even if the agreement's subject matter involves 400 to 500 million dollars, it does not significantly impact his overall asset portfolio.Sun Yuchen also stated that he invests with the patience of an old hunter. Once he is thoroughly optimistic and makes a significant decision, he will invest at least 4 to 5 billion dollars or more in a single transaction.

first_img Samsung and SK Hynix respond to HBM4E heat dissipation, AI intermediary layer may expand to 40 times

TrendForce reported on October 12, citing Chosun Biz, that as AI packaging accommodates more computing and storage chips, the intermediary layer connecting computing chips and HBM is expected to significantly increase in size, making next-generation HBM cooling more important. Samsung Electronics is preparing multiple technologies to address the cooling challenges of HBM4E, which is scheduled to begin mass production next year.Currently, the area of the AI intermediary layer is about 5.5 times the maximum exposure area of 858 square millimeters of an EUV lithography machine. Semiconductor equipment industry insiders expect that the intermediary layer carrying HBM could expand to 9 times, 12 times that area, and ultimately about 40 times. Reasons include limitations in process miniaturization and the popularity of chiplet-style 2.5D packaging, where multiple computing chiplets and HBM stacks are placed on the same intermediary layer, making it difficult for a single advanced process chip to meet AI computing power demands.Samsung is considering hybrid copper bonding and thermal path blocks. The former replaces the micro bumps between stacked DRAM chips with direct copper-to-copper connections, which can reduce inter-layer gaps, make the stack thinner, and improve heat dissipation, a technology Samsung showcased at NVIDIA GTC in March 2026. The thermal path block establishes a dedicated thermal path in the D2D PHY area responsible for high-speed transmission between HBM base chips and GPUs, which Samsung is validating with HBM4E and plans to implement in HBM5. According to ETNews, SK Hynix's iHBM places high thermal conductivity but electrically insulating cooling materials around the heat-concentrated D2D PHY, which is expected to reduce thermal resistance by about 30%.
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