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DeepQA launches Arc Campaign: 11 Agent QAs for Arc ecosystem applications completed in 16 hours, powered by WORLD3 and Google Cloud Vertex AI

On September 16, the day Circle Arc's mainnet went live, the AI Agent quality assurance product DeepQA released the Arc Campaign, completing public QA for 11 ecological applications on the Arc testnet and publishing all 13 reports on the official website in a collection format. From the initiation of the project to the public release of reports for all 11 applications, it took about 16 hours.Real-time data from the official website shows that this event executed a total of 141 test scenarios, of which 117 passed, confirming 15 issues. The Critic Agent conducted real-time reviews 30 times, retaining 141 scenarios, 436 screenshots, approximately 2,200 model calls, and 16.9 million tokens. The covered applications include the Arc official testnet browser, Tower Exchange, AchSwap, Machina Bridge, OmniHub, ArcFX, SettleOne, Syn DAO, thirdweb Arc Testnet, ChainGPT Pad, and Karwan. All tests were conducted in real browsers on live applications, with the injected test wallets holding only testnet funds and no real funds used.The backend of DeepQA is powered by WORLD3 and Google Cloud Vertex AI. A group of AI Agents completed exploration, planning, testing, and reporting, with each issue accompanied by screenshot evidence, and only released after being audited and reviewed in real-time by the Critic Agent. The team stated that a decentralized QA network is also in progress, which will prioritize support for the Arc ecosystem.

first_img TSMC 3/2 nanometers and CoWoS remain tight, AWS and MediaTek's capacity allocation has changed

As we enter the late third quarter of 2026, TSMC's 3nm and 2nm advanced process and CoWoS advanced packaging capacity continue to be in high demand. NVIDIA and Apple continue to dominate the resources for advanced processes and packaging; Amazon AWS's Annapurna has recently increased its AI self-developed chip production, securing more 3nm capacity. MediaTek, in addition to mobile chips, is also competing for 2/3nm process and CoWoS-S/L capacity with large orders related to Google TPU.There are reports that TSMC has recently readjusted its capacity allocation. After MediaTek secured a large order from Google TPU, the next-generation TPU v9 will simultaneously use TSMC's CoWoS-L and Intel's EMIB-T, which has slightly adjusted MediaTek's 3nm and 2nm capacity arrangements. Currently, TSMC's main customer for 3nm is NVIDIA, which is expected to surpass Apple to become the largest customer by 2025; the demand for 2nm is primarily from Apple and others. After AWS increased Annapurna's production, its 3nm and CoWoS configuration priority has improved.Starting in early 2026, TSMC will accelerate capacity expansion, with the 2nm monthly capacity of Hsinchu Baoshan Fab 20 and Kaohsiung Fab 22 reaching 50,000 wafers each by the end of October, totaling about 100,000 wafers; by the end of October, the monthly capacity for 3nm in Tainan Science Park is about 185,000 wafers. As of the end of September, the overall capacity utilization rate is about 96.2%, with 100% utilization for processes below 16/12nm down to 2nm. The shortage of CoWoS supply has driven advanced packaging orders to overflow, with the priority for orders going to ASE Group's Siliconware Precision Industries first, followed by Amkor, and Chipbond, among others. Chipbond's related testing and packaging capacity is fully loaded, with order visibility extending to 2028.
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