Data: The U.S. government has launched a $1.6 billion funding competition aimed at accelerating the development of advanced semiconductor packaging technology in the United States
ChainCatcher News, U.S. Department of Commerce: The Biden-Harris administration launches a competition for up to $1.6 billion in funding to accelerate the development of advanced semiconductor packaging technology in the United States.
Related tags
ChainCatcher reminds readers to view blockchain rationally, enhance risk awareness, and be cautious of various virtual token issuances and speculations. All content on this site is solely market information or related party opinions, and does not constitute any form of investment advice. If you find sensitive information in the content, please click "Report", and we will handle it promptly.
Related tags