Data: The U.S. government has launched a $1.6 billion funding competition aimed at accelerating the development of advanced semiconductor packaging technology in the United States

2024-10-19 09:40:17
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ChainCatcher News, U.S. Department of Commerce: The Biden-Harris administration launches a competition for up to $1.6 billion in funding to accelerate the development of advanced semiconductor packaging technology in the United States.

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